Features
1. The infrared temperature sensor can detect the surface temperature of BGA. So the closed-loop control is realized to provide the even heat distribution to the infrared BGA rework station.
2. To obtain the accurate and correct process curve, the RPC is designed to monitor the melting process of BGA solder ball.
3. The PC is connected to the machine via IRSoft to record and analyze the processing procedure, and to form the curve chart for production.
Specifications
Power | 2400W (Max.) |
Bottom Preheating Power | 1600W(400W×4, dark infrared heater) |
2000W(200W×4, high infrared heating tube, optional) | |
Power of Top Heater | 720W(120W×6, infrared heating tube, wave length: 2-8µm) |
Range of Top Heating Area | 20-60mm(X, Y adjustable) |
Heating Time of Top Heater | About 10s (room temperature-230℃) |
Range of Bottom Preheating Area | 290×290mm |
| Max. PCB Size | 400×400mm |
Communication | Standard USB (Connected with PC) |
Temperature Sensor | Non-contact infrared sensor |
Movable Motor | Step motor |
Weight | 40kg |
Dimension | 850(L)×650(W)×730(H) |
RPC
RPC | 22*10 times magnification |
Horizontal resolution: 480 lines | |
PAL format |
Note: the motor is not included in this product. Customers can purchase the motor when needed.
