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QUICK EA-H15

Chất lượng

Giá liên hệ

Tình trạng: Còn hàng

Liên hệ : 0243.99.88.282

      Features

1. The infrared sensor is used to detect the surface temperature of BGA. So the closed-loop control and the even heat distribution is realized.

2. The PL part of the infrared BGA rework station is designed with dichromatic vision alignment, which realizes the good coordination of the solder ball and the pad.

3. The machine is connected with PC via IRSoft to record and analyze the operating process, and form the curve.

 

      Specifications

IR

Power

2600W (Max.)

Bottom Preheating Power

1600W (400W×4, dark infrared heater)

2000W (500W×4, high infrared heating tube, optional)

Power of Top Heater

720W (120W×6, infrared heating tube, wave length: 2-8µm)

Range of Top Heating Area

20-60mm (X, Y adjustable)

Bottom Preheating Area

290×290mm

 

400×400mm

Communication

USB (Connected with PC)

Temperature Sensor

Non-contact infrared sensor

Weight

About 55kg

Dimension

850(L)×650(W)×730(H)mm

PL

Camera

22×10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PAL format

Prism Size

50mm×50mm

BGA Size Range

2×2-60×60(mm)

Video Output Signal

Video signal

RPC

RPC

22×10 times magnifying

Horizontal resolution: 480 lines

PAL format

 

Notemonitor is not the standard configuration for this product. It is optional.

 


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